File:ASIC-tsmc bondpads.png: Difference between revisions

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current	13:03, 26 October 2010		708 × 751 (436 KB)	Dorn (talk \| contribs)	Modified distance to the scribeline and IO structure
	11:30, 8 July 2010		708 × 751 (425 KB)	Dorn (talk \| contribs)

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Revision as of 11:30, 8 July 2010 (view source) Dorn (talk \| contribs) No edit summary	Latest revision as of 13:03, 26 October 2010 (view source) Dorn (talk \| contribs) (uploaded a new version of "File:ASIC-tsmc bondpads.png": Modified distance to the scribeline and IO structure)
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